收藏本站
16Mb: 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
Configuration Registers
Bus Configuration Register
The BCR defines how the CellularRAM device interacts with the system memory bus.
Page mode operation is enabled by a bit contained in the RCR. Figure 17 describes the
control bits in the BCR. At power-up, the BCR is set to 9D4Fh.
The BCR is accessed using CRE and A[19] HIGH or through the configuration register
software sequence with DQ = 0001h on the third cycle.
Figure 17:
Bus Configuration Register Definition
A19 A[18:1 6 ]
A15
A14 A13 A12A11 A10
A9
A8
A7
A 6
A5
A4
A3
A2 A1 A0
19
18–1 6
15
14
13 12 11
10
9
8
7
6
5
4
3
2
1
0
Re g ister
S ele c t
Reserve d
Operatin g
Mo d e
Reserve d
Laten c y
C ounter
WAIT
Polarity
Reserve d
WAIT
C onfi g uration (W C )
Reserve d
C lo c k
C onfi g uration ( CC )
Output
Impe d an c e
Reserve d
Burst Burst
Wrap (BW)* Len g th (BL)*
Must b e set to "0"
Must b e set to "0"
Must b e set to "0"
Must b e set to "0"
Must b e set to "0"
BCR[13] BCR[12] BCR[11]
Latency Counter
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
C o d e 0–Reserve d
C o d e 1–Reserve d
C o d e 2
C o d e 3 (Default)
C o d e 4–Reserve d
C o d e 5–Reserve d
C o d e 6 –Reserve d
C o d e 7–Reserve d
BCR[3]
0
1
Burst Wrap (Note 1)
Burst wraps within the b urst len g th
Burst no wrap ( d efault)
BCR[10]
0
1
BCR[8]
WAIT Polarity
A c tive LOW
A c tive HI G H ( d efault)
WAIT Configuration
BCR[6]
BCR[5]
0
1
Output Impedance
Full Drive ( d efault)
1/4 Drive
Clock Configuration
BCR[15]
0
1
Asserte d d urin g d elay
Asserte d one d ata c y c le b efore d elay ( d efault)
Operation Mode
0
1
Not supporte d
Risin g e dg e ( d efault)
0
S yn c hronous b urst a cc ess mo d e
BCR[2]
BCR[1] BCR[0]
Burst Length (Note 1)
1
Asyn c hronous a cc ess mo d e ( d efault)
0
0
0
1
1
0
4 wor d s
8 wor d s
BCR[19]
0
S ele c t R C R
Register Select
0
1
1
1
1
1
1 6 wor d s
C ontinuous b urst ( d efault)
1
S ele c t B C R
Note:
All burst WRITEs are continuous.
PDF: 09005aef81cb58ed/Source: 09005aef81c7a667
16mb_burst_cr1_0_p23z_2.fm - Rev. H 4/08 EN
23
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2005 Micron Technology, Inc. All rights reserved.
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
MT48H32M16LFB4-75B IT:C IC SDRAM 512MB 54VFBGA
MT48H8M16LFB4-75 IT:K TR IC SDRAM 128MBIT 133MHZ 54VFBGA
MTC100-JA2-P34 CONTACT INSERT PIN
MX841BE IC CONVERTER WHITE LED 8-SOIC
MXHV9910BTR IC LED DRIVER HIGH BRIGHT 8-SOIC
MXN12FB12F MOTOR BRUSHED DC 12V 2922RPM
MXN13FB08B1 MOTOR BRUSHED DC 8V 4714RPM
N01L63W2AB25I IC SRAM ASYNC 1MBIT ULP 48-BGA
相关代理商/技术参数
MT45W1MW16BDGB-708 AT TR 功能描述:IC PSRAM 16MBIT 70NS 54VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G（256M x 16） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6
MT45W1MW16BDGB-708 IT 制造商:Micron Technology Inc 功能描述:PSRAM Async 1 16M-Bit 1M x 16 70ns 54-Pin VFBGA Tray
MT45W1MW16BDGB-708 IT TR 制造商:Micron Technology Inc 功能描述:
MT45W1MW16BDGB-708 WT 制造商:Micron Technology Inc 功能描述:PSRAM Async 1 16M-Bit 1M x 16 70ns 54-Pin VFBGA Tray
MT45W1MW16BDGB-708 WT TR 功能描述:IC PSRAM 16MBIT 70NS 54VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:移动 SDRAM 存储容量:256M（8Mx32） 速度:133MHz 接口:并联 电源电压:1.7 V ~ 1.95 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:带卷 (TR) 其它名称:557-1327-2
MT45W1MW16BP23ZWC2 制造商:Micron Technology Inc 功能描述:1MX16 PSRAM DIE-COM 1.8V BURST PSEUDO STATIC 1.8V I/O - Bulk
MT45W1MW16PABA-70 WT 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M（8Mx32） 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:托盘 其它名称:Q2841869
MT45W1MW16PABA-70 WT TR 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M（1M x 8，512K x 16） 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA（7x7） 包装:托盘